Invention Grant
- Patent Title: Heating apparatus and substrate processing apparatus having the same
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Application No.: US15417503Application Date: 2017-01-27
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Publication No.: US10508333B2Publication Date: 2019-12-17
- Inventor: Byeong-Hoon Kim , Byung-Hwan Kong , Sung-Han Lee , Sun Cho , Seung-Hwan Kang , Seung-Ho Lee , Han-Seo Ko
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.,Sungkyunkwan University's Research & Business Foundation
- Current Assignee: Samsung Electronics Co., Ltd.,Sungkyunkwan University's Research & Business Foundation
- Current Assignee Address: KR Gyeonggi-do KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0011115 20160129
- Main IPC: C23C16/02
- IPC: C23C16/02 ; C23C16/458 ; F28F13/18 ; H05B1/02 ; H05B3/46 ; C23C16/46 ; H01L21/67

Abstract:
A heating apparatus including a side wall heat insulator configured to provide an inner space for receiving a reaction tube, an upper wall heat insulator covering a top portion of the side wall heat insulator, a heat generation part in an inner surface of the side wall heat insulator, and a heat compensating part on a lower surface of the upper wall heat insulator, the heat compensating part including a reflection surface in a first region on the lower surface of the upper wall heat insulator, the first region having a first emissivity less than an emissivity of the upper wall heat insulator may be provided.
Public/Granted literature
- US20170218507A1 HEATING APPARATUS AND SUBSTRATE PROCESSING APPARATUS HAVING THE SAME Public/Granted day:2017-08-03
Information query
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