Invention Grant
- Patent Title: Coil electronic component and method of manufacturing the same
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Application No.: US16507982Application Date: 2019-07-10
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Publication No.: US10515755B2Publication Date: 2019-12-24
- Inventor: Ki Seok Kim , Ye Jeong Kim , Myung Sam Kang , Kwang Hee Kwon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0146030 20161103
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F41/04 ; H01F27/29 ; H01F27/32 ; H01F41/12 ; H01F17/00
Abstract:
A coil electronic component includes: a plurality of stacked coil layers each including coil patterns including anisotropic plating layers; conductive vias connecting the coil patterns formed on different coil layers to each other; and external electrodes electrically connected to the plurality of coil layers.
Public/Granted literature
- US20190333683A1 COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-10-31
Information query
