公开(公告)号：US10515755B2

公开(公告)日：2019-12-24

申请号：US16507982

申请日：2019-07-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ki Seok Kim ,  Ye Jeong Kim ,  Myung Sam Kang ,  Kwang Hee Kwon

IPC: H01F5/00 ,  H01F27/28 ,  H01F41/04 ,  H01F27/29 ,  H01F27/32 ,  H01F41/12 ,  H01F17/00

Abstract: A coil electronic component includes: a plurality of stacked coil layers each including coil patterns including anisotropic plating layers; conductive vias connecting the coil patterns formed on different coil layers to each other; and external electrodes electrically connected to the plurality of coil layers.

公开(公告)号：US12101880B2

公开(公告)日：2024-09-24

申请号：US17688219

申请日：2022-03-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hee-Joon Chun ,  Jae Sung Sim ,  Hak Young Lee ,  Kwang Hee Kwon ,  Hee Jung Jung

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/092 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/422 ,  H05K3/423 ,  H05K3/429 ,  H05K2201/0391 ,  H05K2201/09563 ,  H05K2203/025

Abstract: A printed circuit board includes: a first insulating layer; a first metal layer disposed on one surface of the first insulating layer; a second metal layer disposed on the other surface facing the one surface of the first insulating layer; a via penetrating through the first insulating layer to connect the first and second metal layers to each other; and a heterogeneous metal region disposed in at least one of an area in which the via is adjacent to the first insulating layer and an area in which the via is adjacent to the first metal layer, and including a material different from that of the via, wherein the heterogeneous metal region includes at least one of nickel (Ni), silicon (Si), and titanium (Ti).

公开(公告)号：US10395814B2

公开(公告)日：2019-08-27

申请号：US15660640

申请日：2017-07-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ki Seok Kim ,  Ye Jeong Kim ,  Myung Sam Kang ,  Kwang Hee Kwon

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/29 ,  H01F41/04 ,  H01F27/32 ,  H01F41/12 ,  H01F17/00

Abstract: A coil electronic component includes: a plurality of stacked coil layers each including coil patterns including anisotropic plating layers; conductive vias connecting the coil patterns formed on different coil layers to each other; and external electrodes electrically connected to the plurality of coil layers.