- 专利标题: Carrier and integrated memory
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申请号: US15948023申请日: 2018-04-09
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公开(公告)号: US10515929B2公开(公告)日: 2019-12-24
- 发明人: Charles L. Arvin , Brian M. Erwin , Mark W. Kapfhammer , Brian W. Quinlan , Charles L. Reynolds , Thomas Weiss
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: ZIP Group PLLC
- 主分类号: H01L23/52
- IPC分类号: H01L23/52 ; H01L21/56 ; H01L25/065 ; H01L23/522 ; H01L23/13 ; H01L25/00 ; H01L23/538
摘要:
An integrated circuit (IC) chip carrier includes one or more memory devices therein. The memory is integrated into the carrier prior to the IC chip being connected to the carrier. Therefore, the IC chip may be connected to the memory at the same time as the IC chip is connected to the carrier. Because the memory is integrated into the IC chip carrier, prior to the IC chip being attached thereto, reliability concerns that result from attaching the memory to the IC chip carrier affect the IC chip carrier and do not affect the yield of the relatively more expensive IC chip.
公开/授权文献
- US20190312009A1 CARRIER AND INTEGRATED MEMORY 公开/授权日:2019-10-10
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