Invention Grant
- Patent Title: Fin field effect transistor (FinFET) device structure with dummy fin structure and method for forming the same
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Application No.: US15692768Application Date: 2017-08-31
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Publication No.: US10522409B2Publication Date: 2019-12-31
- Inventor: Tzung-Yi Tsai , Yen-Ming Chen , Tsung-Lin Lee , Chih-Chieh Yeh
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L27/088

Abstract:
A fin field effect transistor (FinFET) device structure with dummy fin structures and method for forming the same are provided. The FinFET device structure includes an isolation structure over a substrate and a first fin structure extended above the isolation structure. The FinFET device structure includes a second fin structure embedded in the isolation structure and a liner layer formed on sidewalls of the first fin structures and sidewalls of the second fin structures. The FinFET device structure also includes a material layer formed over the second fin structures, and the material layer and the isolation structure are made of different materials.
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Information query
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