Invention Grant
- Patent Title: Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates
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Application No.: US13276143Application Date: 2011-10-18
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Publication No.: US10522452B2Publication Date: 2019-12-31
- Inventor: Kuei-Wei Huang , Wei-Hung Lin , Chih-Wei Lin , Chun-Cheng Lin , Meng-Tse Chen , Ming-Da Cheng , Ching-Shi Liu
- Applicant: Kuei-Wei Huang , Wei-Hung Lin , Chih-Wei Lin , Chun-Cheng Lin , Meng-Tse Chen , Ming-Da Cheng , Ching-Shi Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/498
Abstract:
Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates.
Public/Granted literature
- US20130095611A1 Packaging Methods for Semiconductor Devices Public/Granted day:2013-04-18
Information query
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