Invention Grant
- Patent Title: Methods of manufacturing semiconductor device
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Application No.: US15719121Application Date: 2017-09-28
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Publication No.: US10522694B2Publication Date: 2019-12-31
- Inventor: I-Sheng Chen , Szu-Wei Huang , Hung-Li Chiang , Cheng-Hsien Wu , Chih Chieh Yeh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66 ; H01L29/423 ; H01L29/10 ; H01L29/78 ; H01L29/06 ; B82Y10/00 ; H01L29/40 ; H01L29/775 ; H01L29/04 ; H01L21/8238 ; H01L27/04

Abstract:
A semiconductor device includes channel layers disposed over a substrate, a source/drain region disposed over the substrate, a gate dielectric layer disposed on and wrapping each of the channel layers, and a gate electrode layer disposed on the gate dielectric layer and wrapping each of the channel layers. Each of the channel layers includes a semiconductor wire made of a core region, and one or more shell regions. The core region has an approximately square-shape cross section and a first shell of the one or more shells forms a first shell region of an approximately rhombus-shape cross section around the core region and is connected to an adjacent first shell region corresponding to a neighboring semiconductor wire.
Public/Granted literature
- US20180175214A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-06-21
Information query
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