Invention Grant
- Patent Title: Systems and methods for replaceable bail grid array (BGA) packages on board substrates
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Application No.: US16072367Application Date: 2016-04-01
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Publication No.: US10531575B2Publication Date: 2020-01-07
- Inventor: Sandeep Sane , Timothy Swettlen
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Eversheds Sutherland (US) LLP
- International Application: PCT/US2016/025656 WO 20160401
- International Announcement: WO2017/171857 WO 20171005
- Main IPC: H05K3/40
- IPC: H05K3/40 ; H05K3/34 ; H01L23/498

Abstract:
The systems and methods described herein are directed to using a plurality of interface elements (e.g., sockets) and/or stud-bump elements embedded into board substrates (e.g., a motherboard) to enable the interchange of variable configuration components (e.g., electronic components, chips, and the like) that are mounted on package substrates having ball grid arrays (BGAs). In some aspects, this interchange can be accomplished while leaving the pre-existing board substrate design and various peripheral system components of the board substrate unchanged.
Public/Granted literature
- US20190037708A1 SYSTEMS AND METHODS FOR REPLACEABLE BAIL GRID ARRAY (BGA) PACKAGES ON BOARD SUBSTRATES Public/Granted day:2019-01-31
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