A heat conductor of electronic device 1 includes a heat conductive rubber having elasticity, a heat conductive plate having elasticity so as to be bending deformable, and heat conductive support members, which are disposed between a bottom face of a housing and a CPU in order in a direction from the CPU to the bottom face so as to abut the bottom face and the CPU. The heat conductive support members are configured to abut the heat conductive plate at a plurality of positions separated away from the heat conductive rubber in a surface direction. The heat conductive plate bending-deformed toward the bottom face is supported by the heat conductive rubber and the heat conductive support members.