- 专利标题： Structures and methods for reliable packages
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申请号： US15649457申请日： 2017-07-13
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公开(公告)号： US10535564B2公开(公告)日： 2020-01-14
- 发明人: Cyprian Emeka Uzoh , Guilian Gao , Liang Wang , Hong Shen , Arkalgud R. Sitaram
- 申请人： Invensas Corporation
- 申请人地址： US CA San Jose
- 专利权人： Invensas Corporation
- 当前专利权人： Invensas Corporation
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L21/82
- IPC分类号： H01L21/82 ; H01L23/31 ; H01L21/56 ; H01L23/00 ; H01L21/48 ; H01L23/538
摘要：
A device and method of forming the device that includes cavities formed in a substrate of a substrate device, the substrate device also including conductive vias formed in the substrate. Chip devices, wafers, and other substrate devices can be mounted to the substrate device. Encapsulation layers and materials may be formed over the substrate device in order to fill the cavities.
公开/授权文献
- US20170309518A1 Structures and Methods for Reliable Packages 公开/授权日：2017-10-26
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