- 专利标题： Graphics processing integrated circuit package
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申请号： US15482796申请日： 2017-04-09
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公开(公告)号： US10540318B2公开(公告)日： 2020-01-21
- 发明人: Altug Koker , Farshad Akhbari , Feng Chen , Dukhwan Kim , Narayan Srinivasa , Nadathur Rajagopalan Satish , Liwei Ma , Jeremy Bottleson , Eriko Nurvitadhi , Joydeep Ray , Ping T. Tang , Michael Strickland , Xiaoming Chen , Tatiana Shpeisman , Abhishek R. Appu
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： INTEL CORPORATION
- 当前专利权人： INTEL CORPORATION
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Jaffery Watson Mendonsa & Hamilton LLP
- 主分类号： G06F13/40
- IPC分类号： G06F13/40 ; G06T1/20 ; G06F13/00 ; G06F9/30 ; G06F15/80 ; G06N3/04 ; G06N3/063 ; G06N3/08
摘要：
An integrated circuit (IC) package apparatus is disclosed. The IC package includes one or more processing units and a bridge, mounted below the one or more processing unit, including one or more arithmetic logic units (ALUs) to perform atomic operations.
公开/授权文献
- US20180293205A1 GRAPHICS PROCESSING INTEGRATED CIRCUIT PACKAGE 公开/授权日：2018-10-11
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