Invention Grant
- Patent Title: Cableless connection apparatus and method for communication between chassis
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Application No.: US15947028Application Date: 2018-04-06
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Publication No.: US10541941B2Publication Date: 2020-01-21
- Inventor: Matthew J. Adiletta , Aaron Gorius , Myles Wilde , Hugh Wilkinson , Amit Y. Kumar
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Law Office of R. Alan Burnett, P.S
- Main IPC: H04L12/933
- IPC: H04L12/933 ; H05K7/14 ; H04B1/40 ; H04L12/931 ; H04L29/08

Abstract:
Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.
Public/Granted literature
- US20180302341A1 CABLELESS CONNECTION APPARATUS AND METHOD FOR COMMUNICATION BETWEEN CHASSIS Public/Granted day:2018-10-18
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