Invention Grant
- Patent Title: Method of reducing warpage of semiconductor package substrate and device for reducing warpage
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Application No.: US15816519Application Date: 2017-11-17
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Publication No.: US10546794B2Publication Date: 2020-01-28
- Inventor: Seung Wan Kim , Deok Suk Jang , Jeong Ho Yeo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2017-0073249 20170612
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/67 ; H01L23/48 ; H01L23/13 ; H01L23/538 ; H01L23/00 ; H01L21/48 ; H01L25/00 ; H01L25/065
Abstract:
Embodiments disclosed are directed to a method of reducing warpage of a semiconductor package substrate, and a warpage reducing device. The method includes preparing the semiconductor package substrate, heating the prepared semiconductor package substrate, forming at least one bend in the heated semiconductor package substrate, and cooling the semiconductor package substrate having the at least one bend is formed.
Public/Granted literature
- US20180358277A1 METHOD OF REDUCING WARPAGE OF SEMICONDUCTOR PACKAGE SUBSTRATE AND DEVICE FOR REDUCING WARPAGE Public/Granted day:2018-12-13
Information query
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