Invention Grant
- Patent Title: Metal resistors integrated into poly-open-chemical-mechanical-polishing (POC) module and method of production thereof
-
Application No.: US16016058Application Date: 2018-06-22
-
Publication No.: US10546853B2Publication Date: 2020-01-28
- Inventor: Laertis Economikos , Hui Zang , Ruilong Xie
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Ditthavong & Steiner, P.C.
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/06 ; H01L29/51 ; H01L49/02 ; H01L21/768 ; H01L21/285 ; H01L21/3213 ; H01L29/66
Abstract:
A device including RM below the top surface of an HKMG structure, and method of production thereof. Embodiments include first and second HKMG structures over a portion of the substrate and on opposite sides of the STI region, the first and second HKMG structures having a top surface; and a RM over the STI region and between the first and second HKMG structures, wherein the RM is below the top surface of the first and second HKMG structures.
Public/Granted literature
Information query
IPC分类:
