Invention Grant
- Patent Title: Film forming apparatus and operation method of film forming apparatus
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Application No.: US16171667Application Date: 2018-10-26
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Publication No.: US10550470B2Publication Date: 2020-02-04
- Inventor: Hideomi Hane , Kentaro Oshimo , Shimon Otsuki , Takeshi Oyama , Hiroaki Ikegawa , Jun Ogawa
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2017-208566 20171027
- Main IPC: C23C16/34
- IPC: C23C16/34 ; C23C16/455 ; C23C16/458 ; H01L21/02 ; H01L21/687 ; C23C16/46
Abstract:
There is provided a film forming apparatus for performing a film forming process by supplying a film forming gas to a substrate in a vacuum atmosphere, comprising: a processing container in which a mounting part for mounting a substrate thereon is provided; a heating part configured to heat the substrate mounted on the mounting part; an exhaust part configured to evacuate an inside of the processing container; a cooling gas supply part configured to supply a cooling gas into the processing container; a purge gas supply part configured to supply a purge gas into the processing container; and a control part configured to output a control signal so as to execute a step of applying a stress to a thin film formed inside the processing container.
Public/Granted literature
- US20190127849A1 FILM FORMING APPARATUS AND OPERATION METHOD OF FILM FORMING APPARATUS Public/Granted day:2019-05-02
Information query
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