Invention Grant
- Patent Title: Electronic apparatus
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Application No.: US15559111Application Date: 2016-04-04
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Publication No.: US10553520B2Publication Date: 2020-02-04
- Inventor: Hitomi Iizuka , Hiroaki Tsurumi , Shinya Tsuchida , Kenji Hirose , Yuta Tamaki
- Applicant: Sony Interactive Entertainment Inc.
- Applicant Address: JP Tokyo
- Assignee: Sony Interactive Entertainment Inc.
- Current Assignee: Sony Interactive Entertainment Inc.
- Current Assignee Address: JP Tokyo
- Agent Matthew B. Dernier, Esq.
- Priority: JP2015-077167 20150403
- International Application: PCT/JP2016/061034 WO 20160404
- International Announcement: WO2016/159382 WO 20161006
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/40 ; A63F13/90 ; H01L23/433 ; H05K1/02 ; H05K1/18 ; H05K9/00

Abstract:
A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.
Public/Granted literature
- US20180247881A1 Electronic Apparatus Public/Granted day:2018-08-30
Information query
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