Invention Grant
- Patent Title: 3D pillar inductor
-
Application No.: US15178900Application Date: 2016-06-10
-
Publication No.: US10553671B2Publication Date: 2020-02-04
- Inventor: Chengjie Zuo , Jonghae Kim , Daeik Daniel Kim , Changhan Hobie Yun , Mario Francisco Velez
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L49/02 ; H01L21/48 ; H01F17/00 ; H01L23/522 ; H01L23/498 ; H01L23/48 ; H01L23/64 ; H01F27/28 ; H01L23/00
Abstract:
Base pads are spaced by a pitch on a support surface. Conducting members, optionally Cu or other metal pillars, extend up from the base pads to top pads. A top pad interconnector connects the top pads in a configuration establishing an inductor current path between the base pads.
Public/Granted literature
- US20160284789A1 3D PILLAR INDUCTOR Public/Granted day:2016-09-29
Information query
IPC分类:
