Invention Grant
- Patent Title: Method and apparatus for coil integration for uniform wireless charging
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Application No.: US14864452Application Date: 2015-09-24
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Publication No.: US10554078B2Publication Date: 2020-02-04
- Inventor: Songnan Yang , Janardhan Koratikere Narayan , Ntsanderh C. Azenui , Ahmad Khoshnevis
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Spectrum IP Law Group LLC
- Main IPC: H02J50/12
- IPC: H02J50/12 ; H02J7/02 ; H02J50/70

Abstract:
The disclosure relates to a method, apparatus and system to wirelessly charge a device. Specifically, the disclosed embodiments provide improved charging stations for increased active charging area. In one embodiment, the disclosure relates to an offset device for use with a Power Receiving Unit (PRU). The offset device includes a conductive layer supporting an aperture, the aperture aligned with an inner most coil loop of the PRU; and a first slot formed in the conductive layer extending from the aperture to an outside edge of the conductive layer.
Public/Granted literature
- US20160380480A1 METHOD AND APPARATUS FOR COIL INTEGRATION FOR UNIFORM WIRELESS CHARGING Public/Granted day:2016-12-29
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