Invention Grant
- Patent Title: Bulk acoustic wave filter device and method for manufacturing the same
-
Application No.: US15623875Application Date: 2017-06-15
-
Publication No.: US10554191B2Publication Date: 2020-02-04
- Inventor: Chang Hyun Lim , Han Tae Kim , Tae Hun Lee , Tae Kyung Lee , Tae Yoon Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2016-0089387 20160714; KR10-2016-0159251 20161128
- Main IPC: H03H9/15
- IPC: H03H9/15 ; H01L41/09 ; H01L41/053 ; H01L41/047 ; H03H9/10 ; H03H9/64 ; H03H9/00 ; H01L41/277 ; H03H9/17 ; H03H3/02 ; H01L41/23 ; H01L41/25 ; H03H9/02

Abstract:
A bulk acoustic wave filter device and method thereof includes a first layer forming an air gap together with a substrate, a lower electrode disposed over the first layer, a piezoelectric layer disposed to cover a portion of the lower electrode, an upper electrode disposed over the piezoelectric layer, a frame layer disposed below the upper electrode, and a lower electrode reinforcing layer disposed on the lower electrode, other than portions in which the piezoelectric layer is disposed. The lower electrode reinforcing layer is formed by separating the lower electrode reinforcing layer from the upper electrode or the frame layer upon one of the upper electrode and the frame layer being formed.
Public/Granted literature
- US20180019725A1 BULK ACOUSTIC WAVE FILTER DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-01-18
Information query