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    Acoustic resonator and method of manufacturing thereof
    4.
    发明授权
    Acoustic resonator and method of manufacturing thereof 有权

    公开(公告)号：US11431318B2

    公开(公告)日：2022-08-30

    申请号：US16391650

    申请日：2019-04-23

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Won Han ,  Chang Hyun Lim ,  Tae Yoon Kim ,  Sang Uk Son ,  Sang Kee Yoon

    IPC: H03H9/13 ,  H03H9/17 ,  H01L41/047 ,  H03H3/02 ,  H03H9/02

    Abstract: An acoustic resonator includes: a substrate; a resonant portion including a center portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on the substrate, and an extension portion disposed along a periphery of the center portion; and a first metal layer disposed outwardly of the resonant portion to be electrically connected to the first electrode. The extension portion includes a lower insertion layer disposed on an upper surface of the first electrode or a lower surface of the first electrode. The piezoelectric layer includes a piezoelectric portion disposed in the center portion, and a bent portion disposed in the extension portion and extended from the piezoelectric portion at an incline according to a shape of the lower insertion layer. The lower insertion layer is formed of a conductive material extending an electrical path between the first electrode and the first metal layer.

    ACCELERATION SENSOR
    8.
    发明申请
    ACCELERATION SENSOR 审中-公开
    加速传感器

    公开(公告)号：US20150059477A1

    公开(公告)日：2015-03-05

    申请号：US14462359

    申请日：2014-08-18

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong Woon Kim ,  Sung Jun Lee ,  Chang Hyun Lim

    IPC: G01P15/12 ,  H01L41/113

    CPC classification number: G01P15/123 ,  G01P15/18 ,  G01P2015/0842

    Abstract: Disclosed herein is an acceleration sensor including: a mass; a flexible beam on which an electrode or a piezoresistive element is disposed and the mass is coupled; and a support part connecting to and supporting the flexible beam and having therein a stress isolating slit facing the mass, wherein the mass, the flexible beam and the support part are formed by coupling first and second substrates, wherein the first substrate has a first masking pattern formed thereon corresponding to the flexible beam, the mass and the support part and the second substrate has a second masking pattern formed thereon corresponding to the mass and the support part.

    Abstract translation: 本文公开了一种加速度传感器，包括：质量; 柔性梁，其上设置电极或压阻元件并且所述质量块被联接; 以及连接到所述柔性梁并支撑所述柔性梁并且在其中具有面向所述质量块的应力隔离狭缝的支撑部分，其中所述质量块，所述柔性梁和所述支撑部分通过联接第一和第二基板形成，其中所述第一基板具有第一掩蔽 形成在其上的图案对应于柔性梁，质量和支撑部分和第二基板具有形成在其上的与质量块和支撑部分对应的第二掩模图案。

    HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    加热基板及其制造方法

    公开(公告)号：US20130042963A1

    公开(公告)日：2013-02-21

    申请号：US13655376

    申请日：2012-10-18

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

    IPC: B32B37/12 ,  B32B38/08 ,  B32B38/04

    CPC classification number: H05K1/0203 ,  H05K1/053 ,  H05K1/141 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49083 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1064

    Abstract: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.

    Abstract translation: 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热​​量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。

    Bulk-acoustic wave resonator
    10.
    发明授权
    Bulk-acoustic wave resonator 有权

    公开(公告)号：US10892737B2

    公开(公告)日：2021-01-12

    申请号：US16388979

    申请日：2019-04-19

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Won Han ,  Tae Yoon Kim ,  Sang Uk Son ,  Chang Hyun Lim

    IPC: H03H9/54 ,  H03H9/13 ,  H03H9/205 ,  H03H9/02

    Abstract: A bulk-acoustic wave resonator includes a substrate; a membrane layer forming a cavity with the substrate; a first electrode at least partially disposed on an upper portion of the cavity including an end portion that is thicker than other portions of the first electrode; an insertion layer including a first portion disposed adjacent to from the end portion of the first electrode and a second portion disposed on an upper portion of the first electrode; a piezoelectric layer disposed to cover the insertion layer; and a second electrode disposed on an upper portion of the piezoelectric layer.

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