Invention Grant
- Patent Title: Method of forming electrical connections with solder dispensing and reflow
-
Application No.: US14833549Application Date: 2015-08-24
-
Publication No.: US10556284B2Publication Date: 2020-02-11
- Inventor: Aaron Collins , Paul Davidson , Ralph Smith
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Agency: Kagan Binder, PLLC
- Main IPC: B23K1/005
- IPC: B23K1/005 ; B23K1/00

Abstract:
A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube comprising tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to provide a level of thermal energy to liquefy the solder sphere, detecting the movement of the liquefied solder sphere after it has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.
Public/Granted literature
- US20170056995A1 METHOD OF FORMING ELECTRICAL CONNECTIONS WITH SOLDER DISPENSING AND REFLOW Public/Granted day:2017-03-02
Information query
IPC分类: