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公开(公告)号：US20200038982A1
公开(公告)日：2020-02-06
申请号：US16051682
申请日：2018-08-01
Applicant: Seagate Technology LLC
Inventor： Jonathan Paul Robelia , Paul Davidson , Amy Jo Bergerud
IPC: B23K3/06
Abstract: Implementations described and claimed herein address the foregoing problems by providing a soldering method including mixing a plurality of spheres in a bond-head hopper wherein a first number of the plurality of the spheres have a diameter that is at least fifty (50) percent larger than the rest of the plurality of spheres.
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公开(公告)号：US08947830B1
公开(公告)日：2015-02-03
申请号：US14300442
申请日：2014-06-10
Applicant: Seagate Technology LLC
Inventor： Aaron Michael Collins , Scott Matzke , Christopher Unger , Paul Davidson , Daniel Richard Buettner
IPC: G11B5/48
CPC classification number: G11B5/4853
Abstract: A method for forming an electrical interconnection between a slider pad and a suspension pad that is adjacent to and positioned at an angle relative to the slider pad, which includes the steps of forming a solder bump on a first surface of the slider pad, reshaping the solder bump into a protrusion having an ellipsoidal shape that extends from the slider pad and contacts the suspension pad, and applying a laser to the ellipsoidal protrusion to reflow the solder bump while simultaneously applying a downward pressure to the solder bump in order to form a solder fillet between the slider pad and the suspension pad.
Abstract translation: 一种用于在滑块和悬挂垫之间形成电相互连接的方法，该方法与滑块相邻且相对于滑块形成一定角度，该方法包括以下步骤：在滑块的第一表面上形成焊料凸点，重新形成 焊料凸块进入具有从滑块垫延伸并接触悬挂垫的椭圆形状的突起，并将激光施加到椭圆形突起以回流焊料凸块，同时向焊料凸块施加向下的压力以形成焊料 滑块和悬挂垫之间的圆角。
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公开(公告)号：US20200164453A1
公开(公告)日：2020-05-28
申请号：US16776966
申请日：2020-01-30
Applicant: Seagate Technology LLC
Inventor： Aaron Collins , Paul Davidson , Ralph Smith
Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to and at an angle relative to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube having tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to liquefy the solder sphere until it falls from the exit orifice, waiting for a predetermined time period after the liquefied solder sphere has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.
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公开(公告)号：US10646943B2
公开(公告)日：2020-05-12
申请号：US15361714
申请日：2016-11-28
Applicant: Seagate Technology LLC
Inventor： Aaron Michael Collins , Scott Daemon Matzke , Paul Davidson , Christopher R. Libby
Abstract: A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.
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公开(公告)号：US11541471B2
公开(公告)日：2023-01-03
申请号：US16776966
申请日：2020-01-30
Applicant: Seagate Technology LLC
Inventor： Aaron Collins , Paul Davidson , Ralph Smith
Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to and at an angle relative to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube having tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to liquefy the solder sphere until it falls from the exit orifice, waiting for a predetermined time period after the liquefied solder sphere has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.
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Patent Agency Ranking
公开(公告)号：US20200098388A1
公开(公告)日：2020-03-26
申请号：US16139590
申请日：2018-09-24
Applicant: Seagate Technology LLC
Inventor： Paul Davidson , Scott Damon Matzke , Christopher Unger , Aaron Collins
IPC: G11B5/48
Abstract: An apparatus includes a slider which includes a slider body with a leading edge and a trailing edge and a plurality of slider bond pads disposed at the trailing edge. The slider bond pads are configured to align opposite to suspension trace bond pads on a suspension to form a solderable gap between the slider bond pads and the suspension trace bond pads.
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公开(公告)号：US10600436B1
公开(公告)日：2020-03-24
申请号：US16239641
申请日：2019-01-04
Applicant: Seagate Technology LLC
Inventor： Paul Davidson , Aaron Collins , Scott D. Matzke
Abstract: An apparatus includes a slider body with a first portion formed of a first insulating material and a second portion formed of a second insulating material that is different from the first insulating material. The second portion of the slider body is at a trailing edge of the slider body and the second portion includes a bearing surface and a top surface opposite the bearing surface. A plurality of bond pads are disposed on the top surface of the second portion such that an entire bottom surface of each of the plurality bond pads is attached to the top surface of the second portion.
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公开(公告)号：US20190122694A1
公开(公告)日：2019-04-25
申请号：US15788886
申请日：2017-10-20
Applicant: Seagate Technology LLC
Inventor： Paul Davidson , Scott Damon Matzke , Aaron Michael Collins
Abstract: A magnetic recording head including a trailing surface and a plurality of bond pads in a row, each of which is spaced by a gap from an adjacent bond pad along a width of the trailing surface. Each bond pad includes two side edges spaced from each other across a width of the bond pad, wherein a width of the gap between adjacent bond pads is defined by one side edge of each of two adjacent bond pads, and a top edge extending between the two side edges. The head further includes at least one solder dam including a nonwettable, electrically conductive solder material positioned adjacent to the top edge of at least one of the bond pads.
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9.发明申请公开(公告)号：US20170056995A1
公开(公告)日：2017-03-02
申请号：US14833549
申请日：2015-08-24
Applicant: Seagate Technology LLC
Inventor： Aaron Collins , Paul Davidson , Ralph Smith
CPC classification number: B23K1/0056 , B23K1/0016 , B23K3/0623
Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube comprising tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to provide a level of thermal energy to liquefy the solder sphere until it falls from the exit orifice toward the connection area between the first and second components, detecting the movement of the liquefied solder sphere after it has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.
Abstract translation: 一种用于将头部万向节组件的多个部件与焊接接头相互连接的方法，包括以下步骤：将第一部件邻近第二部件定位，以提供第一和第二部件之间的连接区域，将焊球分配到毛细管 包括锥形壁，其中毛细管定位成在第一和第二部件之间的连接区域上方具有出口孔，对毛细管加压直到达到预定压力，向焊球施加第一激光脉冲以提供一定程度的 热能使焊球液化，直到其从出口孔落到第一和第二部件之间的连接区域为止，检测液化焊球离开毛细管的出口后的运动，并施加第二激光 脉冲以回流焊球以在第一和第二部件之间形成焊接接头。
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公开(公告)号：US10556284B2
公开(公告)日：2020-02-11
申请号：US14833549
申请日：2015-08-24
Applicant: Seagate Technology LLC
Inventor： Aaron Collins , Paul Davidson , Ralph Smith
Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube comprising tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to provide a level of thermal energy to liquefy the solder sphere, detecting the movement of the liquefied solder sphere after it has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.
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