Invention Grant
- Patent Title: Coil component
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Application No.: US15166519Application Date: 2016-05-27
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Publication No.: US10559417B2Publication Date: 2020-02-11
- Inventor: Hitoshi Ohkubo , Masazumi Arata , Manabu Ohta , Yuuya Kaname , Yoshihiro Maeda , Takahiro Kawahara , Hokuto Eda , Shigeki Sato
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-110591 20150529
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/32

Abstract:
A coil component in which a change in thicknesses of the winding part is prevented is provided. According to the coil component, since each of a pair of neighboring resin walls and a seed part between the pair of resin walls are separated by a predetermined distance, a plating part grown on the seed part is easy to grow uniformly between the pair of neighboring resin walls. For this reason, the winding part whose surface is gentle and in which a change in thickness is prevented is obtained by plating growth.
Public/Granted literature
- US20160351316A1 COIL COMPONENT Public/Granted day:2016-12-01
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