公开(公告)号：US12094636B2

公开(公告)日：2024-09-17

申请号：US17234029

申请日：2021-04-19

Applicant: TDK CORPORATION

Inventor： Hokuto Eda ,  Masataro Saito ,  Kohei Takahashi ,  Takamasa Iwasaki ,  Hitoshi Ohkubo ,  Masazumi Arata

IPC: H01F27/32 ,  H01F27/255 ,  H01F27/28 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F27/255 ,  H01F27/29 ,  H01F27/323 ,  H01F2027/2809

Abstract: In an insulation layer of a coil component, a thickness of a second covering part and a third covering part located on the penetration hole side of a first covering part is thinner than that of the first covering part. A stray capacitance occurring between a flat coil pattern and external terminal electrodes is reduced by making the first covering part of the insulation layer thicker than the second covering part and the third covering part. Further, since the second covering part and the third covering part of the insulation layers are thinner than the first covering part, a magnetic volume is increased while external dimensions of the base body is maintained, and thus a high inductance is realized.

公开(公告)号：US11810708B2

公开(公告)日：2023-11-07

申请号：US18119457

申请日：2023-03-09

Applicant: TDK CORPORATION

Inventor： Takahiro Kawahara ,  Manabu Ohta ,  Kenei Onuma ,  Yuuya Kaname ,  Ryo Fukuoka ,  Hokuto Eda ,  Masataro Saito ,  Kohei Takahashi

IPC: H05K1/18 ,  H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F41/04 ,  H01F27/28

CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/2804 ,  H01F41/041 ,  H05K1/181 ,  H01F2017/048

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

公开(公告)号：US12068099B2

公开(公告)日：2024-08-20

申请号：US17109426

申请日：2020-12-02

Applicant: TDK CORPORATION

Inventor： Masataro Saito ,  Masazumi Arata ,  Hokuto Eda ,  Kohei Takahashi ,  Takamasa Iwasaki

IPC: H01F27/28 ,  H01F27/24 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F27/24 ,  H01F27/29 ,  H01F2027/2809

Abstract: In a coil component, a first planar coil and a second planar coil are wound around a common magnetic core and are magnetically coupled to each other. However, the first planar coil and the second planar coil are not electrically connected to each other and form coil structures which are separate from each other. Thus, as compared with a case in which the first planar coil and the second planar coil form one coil structure, the first planar coil and the second planar coil are less likely to affect each other's characteristics.

公开(公告)号：US11894177B2

公开(公告)日：2024-02-06

申请号：US18119473

申请日：2023-03-09

Applicant: TDK CORPORATION

Inventor： Takahiro Kawahara ,  Manabu Ohta ,  Kenei Onuma ,  Yuuya Kaname ,  Ryo Fukuoka ,  Hokuto Eda ,  Masataro Saito ,  Kohei Takahashi

IPC: H05K1/18 ,  H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F41/04 ,  H01F27/28

CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/2804 ,  H01F41/041 ,  H05K1/181 ,  H01F2017/048

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

公开(公告)号：US11705270B2

公开(公告)日：2023-07-18

申请号：US16877772

申请日：2020-05-19

Applicant: TDK CORPORATION

Inventor： Miyuki Asai ,  Hokuto Eda ,  Masazumi Arata ,  Hitoshi Ohkubo

IPC: H01F27/28 ,  H01F27/255 ,  H01F27/32

CPC classification number: H01F27/2804 ,  H01F27/255 ,  H01F27/324 ,  H01F2027/2809

Abstract: In a coil component, an uneven structure provided by an insulation layer and a resin wall contributes to extension of a contact area with respect to a magnetic body, so that an adhesive force with respect to the magnetic body is improved. In addition, the magnetic body protrudes downward toward an exposed region of the resin wall corresponding to a recessed portion in the uneven structure, a volume thereof is increased, and coil characteristics such as an inductance value are improved.

公开(公告)号：USD1053135S1

公开(公告)日：2024-12-03

申请号：US29821080

申请日：2021-12-27

Applicant: TDK CORPORATION

Designer： Hokuto Eda ,  Hitoshi Ohkubo ,  Masazumi Arata ,  Masataro Saito ,  Kohei Takahashi ,  Takamasa Iwasaki

公开(公告)号：US11631529B2

公开(公告)日：2023-04-18

申请号：US16811610

申请日：2020-03-06

Applicant: TDK CORPORATION

Inventor： Takahiro Kawahara ,  Manabu Ohta ,  Kenei Onuma ,  Yuuya Kaname ,  Ryo Fukuoka ,  Hokuto Eda ,  Masataro Saito ,  Kohei Takahashi

IPC: H05K1/18 ,  H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F41/04 ,  H01F27/28

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

公开(公告)号：US11043329B2

公开(公告)日：2021-06-22

申请号：US16027742

申请日：2018-07-05

Applicant: TDK CORPORATION

Inventor： Hitoshi Ohkubo ,  Masazumi Arata ,  Takahiro Kawahara ,  Hokuto Eda ,  Hiroki Tsujiai

IPC: H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01F27/29 ,  H01F17/04 ,  H01F17/00 ,  H05K1/16 ,  H05K1/18

Abstract: In a planar coil element, a dead space in a non-overlapping region is reduced by designing a total width of a first resin wall and a first turn located in the non-overlapping region to be narrow, more specifically, by designing the total width to be narrower than a total width of a second turn outside the first turn and a second resin wall located inside the turn and also than a total width of a third turn on the outer side and a third resin wall located inside the turn. As a result, a volume of a magnetic element body in a magnetic core portion of a coil can be increased, and an, inductance value, which is a magnetic characteristic, can also be improved.

公开(公告)号：US20240331905A1

公开(公告)日：2024-10-03

申请号：US18617849

申请日：2024-03-27

Applicant: TDK Corporation

Inventor： Manabu OHTA ,  Ryo Fukuoka ,  Yuji Matsuura ,  Hokuto Eda ,  Takahiro Nemoto ,  Kenei Onuma ,  Masazumi Arata ,  Hitoshi Ohkubo

IPC: H01F5/04 ,  H01F27/29

CPC classification number: H01F5/04 ,  H01F27/292

Abstract: In the coil component, the terminal electrode enters an aperture of the element body and is jointed with the bump electrode inside the element body. That is, the terminal electrode is in contact with both the bump electrode and the element body. Therefore, as compared with the case where the bump electrode is exposed to the lower surface of the element body, a joint surface of the terminal electrode is enlarged, and high adhesion of the terminal electrode is realized.

公开(公告)号：US12020854B2

公开(公告)日：2024-06-25

申请号：US17115311

申请日：2020-12-08

Applicant: TDK CORPORATION

Inventor： Hitoshi Ohkubo ,  Miyuki Asai ,  Masazumi Arata ,  Hokuto Eda

IPC: H01F27/32 ,  H01F17/04

CPC classification number: H01F27/324 ,  H01F17/04 ,  H01F2017/048

Abstract: In a coil component, the pressure resistance is improved by main surfaces and of a main body portion being covered with an insulating layer. The main body portion has a surface part, the resin ratio of the surface part is higher than the internal resin ratio, and insulation is enhanced at the surface part. As a result, the pressure resistance on the surface of the main body portion is further improved and the pressure resistance of the entire coil component is further improved.