- 专利标题： Method for manufacturing electronic device and electronic device
-
申请号： US15757832申请日： 2016-12-26
-
公开(公告)号： US10559478B2公开(公告)日： 2020-02-11
- 发明人: Hideki Kamada
- 申请人： SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- 申请人地址： JP Tokyo
- 专利权人： SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- 当前专利权人： SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- 当前专利权人地址： JP Tokyo
- 代理机构： Ladas & Parry, LLP
- 国际申请： PCT/JP2016/088619 WO 20161226
- 国际公布： WO2018/122894 WO 20180705
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/56 ; B29C39/10 ; H01L23/40 ; H01L23/31 ; H01L23/29 ; H01L23/544 ; H01L23/16 ; B29K705/00 ; B29L31/34 ; H01L25/065 ; H01L23/367
摘要：
Manufacturing method for an electronic device comprises a step of placing a substrate 10, which has a metal plate 11 on a back-surface side, on a back-surface-side mold 110 having a mold recessed part 111, a step of placing a front-surface-side mold 120 on the back-surface-side mold so as to cover the substrate 10; and a step of pouring resin between the front-surface mold 100 and the back-surface-side mold 110, when the substrate 10 is pressed against the back-surface-side mold 110. Circumferential part of the metal plate 11 is in contact with an edge of the mold recessed part 111 when the substrate 10 is pressed against the back-surface-side mold 110 in the step of pouring resin.
公开/授权文献
信息查询
IPC分类:
