This semiconductor device has a plurality of external terminals arranged in an array on a bottom surface of a package. The plurality of external terminals include a first external terminal group for receiving an input of a current from outside the device, and a second external terminal group for outputting a current to the outside of the device. The first external terminal group and the second external terminal group are laid out such that respective arrangement patterns thereof are interlocked with each other. The arrangement patterns may be comb-tooth shaped, cross-shaped, S-shaped, T-shaped, L-shaped, or may have a shape comprising a combination thereof. The plurality of external terminals may be pins, solder balls, or electrode pads.