Invention Grant
- Patent Title: Chip resistor and chip resistor assembly
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Application No.: US16389225Application Date: 2019-04-19
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Publication No.: US10559648B2Publication Date: 2020-02-11
- Inventor: Doo Ho Yoo , Jung Il Kim , Young Key Kim , Jung Min Nam
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0054407 20170427; KR10-2017-0073327 20170612
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/10 ; H05K1/16 ; H01C7/00 ; H01L49/02 ; H05K3/34

Abstract:
A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.
Public/Granted literature
- US20190245030A1 CHIP RESISTOR AND CHIP RESISTOR ASSEMBLY Public/Granted day:2019-08-08
Information query
IPC分类: