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    Chip resistor and chip resistor assembly
    1.
    发明授权
    Chip resistor and chip resistor assembly 有权

    公开(公告)号：US10559648B2

    公开(公告)日：2020-02-11

    申请号：US16389225

    申请日：2019-04-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Doo Ho Yoo ,  Jung Il Kim ,  Young Key Kim ,  Jung Min Nam

    IPC: H01L23/31 ,  H01L23/10 ,  H05K1/16 ,  H01C7/00 ,  H01L49/02 ,  H05K3/34

    Abstract: A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.

    Chip resistor and chip resistor assembly
    2.
    发明授权
    Chip resistor and chip resistor assembly 有权

    公开(公告)号：US10312317B2

    公开(公告)日：2019-06-04

    申请号：US15896320

    申请日：2018-02-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Doo Ho Yoo ,  Jung Il Kim ,  Young Key Kim ,  Jung Min Nam

    IPC: H05K1/16 ,  H01L49/02 ,  H01L23/31 ,  H01L23/10

    Abstract: A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.

    Chip resistance element and chip resistance element assembly
    6.
    发明授权
    Chip resistance element and chip resistance element assembly 有权

    公开(公告)号：US10242774B2

    公开(公告)日：2019-03-26

    申请号：US15835291

    申请日：2017-12-07

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jung Min Nam ,  Doo Ho Yoo ,  Young Key Kim

    IPC: H01C1/148 ,  H01C1/01 ,  H05K1/16 ,  H01C1/142 ,  H01C7/00

    Abstract: A chip resistance element includes a base substrate having a first surface and a second surface opposing each other, two sides connecting the first surface and the second surface to each other, and two end surfaces connecting the first surface and the second surface to each other; a resistive layer disposed on the second surface; and a first terminal, a second terminal, and a third terminal disposed to be respectively connected to the resistive layer and to be separated from each other on the second surface. The third terminal having a second surface portion disposed between the first terminal and the second terminal on the second surface and a side portion connected to and disposed on one of the two sides of the base substrate.

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