A method, apparatus and computer readable memory for solder paste inspection. A light source is configured to irradiate a sample solder joint comprising an organic material, an organic and metal material enclosed by an irregular boundary, and a metal material enclosed by a regular boundary. A first wavelength ultraviolet (UV) energy irradiates the sample to obtain first fluorescence energy, and a second wavelength UV energy irradiates the sample to obtain second fluorescence energy. A two-dimensional (2D) camera is configured to acquire a first image of the sample primarily from the first fluorescence energy and a second image of the sample primarily from the second fluorescence energy. Photo manipulation software is stored on at least one hardware processor, the photo manipulation software configured to overlay the first image and the second image to visually compare the boundary of the organic and metal material with the boundary of the metal material.