Invention Grant
- Patent Title: Method of reducing a sheet resistance in an electronic device, and an electronic device
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Application No.: US16116210Application Date: 2018-08-29
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Publication No.: US10573533B2Publication Date: 2020-02-25
- Inventor: Edward Fuergut , Irmgard Escher-Poeppel , Stephanie Fassl , Paul Ganitzer , Gerhard Poeppel , Werner Schustereder , Harald Wiedenhofer
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102015107489 20150512
- Main IPC: H01L21/324
- IPC: H01L21/324 ; H01L23/31 ; H01L21/268 ; H01L21/04 ; H01L21/225 ; H01L21/285
Abstract:
Various embodiments provide a method of reducing a sheet resistance in an electronic device encapsulated at least partially in an encapsulation material, wherein the method comprises: providing an electronic device comprising a multilayer structure and being at least partially encapsulated by an encapsulation material; and locally introducing energy into the multilayer structure for reducing a sheet resistance.
Public/Granted literature
- US20190013210A1 METHOD OF REDUCING A SHEET RESISTANCE IN AN ELECTRONIC DEVICE, AND AN ELECTRONIC DEVICE Public/Granted day:2019-01-10
Information query
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