公开(公告)号：US09614045B2

公开(公告)日：2017-04-04

申请号：US14488334

申请日：2014-09-17

Applicant: Infineon Technologies AG

Inventor： Srinivasa Reddy Yeduru ,  Joachim Hirschler ,  Harald Wiedenhofer ,  Franz Kleinbichler

IPC: H01L29/41 ,  H01L21/02 ,  H01L21/3105

CPC classification number: H01L29/41 ,  H01L21/02063 ,  H01L21/02068 ,  H01L21/31058 ,  H01L21/4853 ,  H01L23/49811

Abstract: In various embodiments, a method of processing a semiconductor device may include providing a semiconductor device comprising a contact pad and a polymer layer; and subjecting at least a part of the contact pad and the polymer layer to a plasma comprising ammonia.

公开(公告)号：US10573533B2

公开(公告)日：2020-02-25

申请号：US16116210

申请日：2018-08-29

Applicant: Infineon Technologies AG

Inventor： Edward Fuergut ,  Irmgard Escher-Poeppel ,  Stephanie Fassl ,  Paul Ganitzer ,  Gerhard Poeppel ,  Werner Schustereder ,  Harald Wiedenhofer

IPC: H01L21/324 ,  H01L23/31 ,  H01L21/268 ,  H01L21/04 ,  H01L21/225 ,  H01L21/285

Abstract: Various embodiments provide a method of reducing a sheet resistance in an electronic device encapsulated at least partially in an encapsulation material, wherein the method comprises: providing an electronic device comprising a multilayer structure and being at least partially encapsulated by an encapsulation material; and locally introducing energy into the multilayer structure for reducing a sheet resistance.

公开(公告)号：US20190013210A1

公开(公告)日：2019-01-10

申请号：US16116210

申请日：2018-08-29

Applicant: Infineon Technologies AG

Inventor： Edward Fuergut ,  Irmgard Escher-Poeppel ,  Stephanie Fassl ,  Paul Ganitzer ,  Gerhard Poeppel ,  Werner Schustereder ,  Harald Wiedenhofer

IPC: H01L21/324 ,  H01L21/285 ,  H01L21/225 ,  H01L21/04 ,  H01L21/321 ,  H01L21/268 ,  H01L23/31

CPC classification number: H01L21/324 ,  H01L21/0455 ,  H01L21/0485 ,  H01L21/2254 ,  H01L21/2258 ,  H01L21/268 ,  H01L21/28512 ,  H01L21/28575 ,  H01L23/3157

Abstract: Various embodiments provide a method of reducing a sheet resistance in an electronic device encapsulated at least partially in an encapsulation material, wherein the method comprises: providing an electronic device comprising a multilayer structure and being at least partially encapsulated by an encapsulation material; and locally introducing energy into the multilayer structure for reducing a sheet resistance.