Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US15468577Application Date: 2017-03-24
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Publication No.: US10573540B2Publication Date: 2020-02-25
- Inventor: Nobuo Kobayashi , Takeki Kogawa , Katsuhiro Yamazaki , Yuki Saito
- Applicant: SHIBAURA MECHATRONICS CORPORATION
- Applicant Address: JP Yokohama-shi
- Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee Address: JP Yokohama-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2016-069323 20160330; JP2017-012627 20170127
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/306

Abstract:
According to one embodiment, a substrate processing apparatus includes a tank that stores a treatment liquid; a liquid level pipe connected to the tank such that the treatment liquid stored in the tank flows therein, and configured such that the liquid level of the treatment liquid therein moves according to increase and decrease of the treatment liquid in the tank; a liquid level sensor that detects the liquid level in the liquid level pipe; an air supply pipe for supplying a gas to a piping space above the liquid level in the liquid level pipe; and a controller that determines whether there is erroneous detection of the liquid level sensor based on a detection result obtained by the liquid level sensor in response to the movement of the liquid level in the liquid level pipe caused by supply of the gas to the piping space from the air supply pipe.
Public/Granted literature
- US20170287744A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2017-10-05
Information query
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