- 专利标题: Substrate processing apparatus and substrate processing method
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申请号: US15468577申请日: 2017-03-24
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公开(公告)号: US10573540B2公开(公告)日: 2020-02-25
- 发明人: Nobuo Kobayashi , Takeki Kogawa , Katsuhiro Yamazaki , Yuki Saito
- 申请人: SHIBAURA MECHATRONICS CORPORATION
- 申请人地址: JP Yokohama-shi
- 专利权人: SHIBAURA MECHATRONICS CORPORATION
- 当前专利权人: SHIBAURA MECHATRONICS CORPORATION
- 当前专利权人地址: JP Yokohama-shi
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2016-069323 20160330; JP2017-012627 20170127
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; H01L21/306
摘要:
According to one embodiment, a substrate processing apparatus includes a tank that stores a treatment liquid; a liquid level pipe connected to the tank such that the treatment liquid stored in the tank flows therein, and configured such that the liquid level of the treatment liquid therein moves according to increase and decrease of the treatment liquid in the tank; a liquid level sensor that detects the liquid level in the liquid level pipe; an air supply pipe for supplying a gas to a piping space above the liquid level in the liquid level pipe; and a controller that determines whether there is erroneous detection of the liquid level sensor based on a detection result obtained by the liquid level sensor in response to the movement of the liquid level in the liquid level pipe caused by supply of the gas to the piping space from the air supply pipe.
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