- 专利标题： Caterpillar trenches for efficient wafer dicing
-
申请号： US16110096申请日： 2018-08-23
-
公开(公告)号： US10573558B1公开(公告)日： 2020-02-25
- 发明人: Effendi Leobandung , Ghavam G. Shahidi
- 申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Tutunjian & Bitetto, P.C.
- 代理商 L. Jeffrey Kelly
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L21/306 ; H01L21/308
摘要：
A method for fabricating caterpillar trenches for wafer dicing includes forming at least one opening from a top surface of a mask formed on a substrate to a bottom surface of the mask opposite the top surface of the mask. The mask is formed on the substrate to protect an electronics device disposed on the substrate during isotropic etching. The method further includes isotropically etching through the at least one opening to form at least one wafer dicing channel, including isotropically etching a collection of nested trenches from a top surface of the substrate to a bottom surface of the substrate opposite the top surface of the substrate.
公开/授权文献
- US20200066589A1 CATERPILLAR TRENCHES FOR EFFICIENT WAFER DICING 公开/授权日：2020-02-27
信息查询
IPC分类:
