The present invention relates to a spring element for a power semiconductor module, wherein the spring element includes a first part made from a first material and a second part made from a second material, the first material being different from the second material, wherein the first part comprises both a first contact portion having a first contact and a second contact portion having a second contact, wherein the first part comprises an electrically conductive path formed from the first contact portion to the second contact portion, and wherein the second part is adapted for exerting a spring force (FS) onto the first contact portion and the second contact portion for pressing the first contact to a first contact area of a power semiconductor module and the second contact to a second contact area of a power semiconductor module. Such a spring element may form a press contact in a power semiconductor module and may be less bulky compared to solutions in the prior art and may be formed cost-sparingly.