Invention Grant
- Patent Title: Horizontal gate all around device isolation
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Application No.: US15279257Application Date: 2016-09-28
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Publication No.: US10573719B2Publication Date: 2020-02-25
- Inventor: Shiyu Sun , Naomi Yoshida , Theresa Kramer Guarini , Sung Won Jun , Benjamin Colombeau , Michael Chudzik
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L29/423 ; H01L21/02 ; H01L21/306 ; H01L21/762 ; H01L29/66 ; H01L29/786 ; H01L29/15

Abstract:
Embodiments described herein generally relate to methods and apparatus for horizontal gate all around (hGAA) isolation. A superlattice structure comprising different materials arranged in an alternatingly stacked formation may be formed on a substrate. The different materials may be silicon containing materials and one or more III/V materials. In one embodiment, at least one of the layers of the superlattice structure may be oxidized to form a buried oxide layer adjacent the substrate.
Public/Granted literature
- US20170018624A1 HORIZONTAL GATE ALL AROUND DEVICE ISOLATION Public/Granted day:2017-01-19
Information query
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