Invention Grant
- Patent Title: Split resonator and printed circuit board including the same
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Application No.: US15603582Application Date: 2017-05-24
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Publication No.: US10573951B2Publication Date: 2020-02-25
- Inventor: Soon Yong Lee , Yeon Sik Yu , Il Kim , Keon Young Seo , Min-Goo Seo , Jae-Deok Lim , Si Ho Jang , Hyun-Tae Jang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC.
- Priority: KR10-2016-0102364 20160811
- Main IPC: H01P7/08
- IPC: H01P7/08 ; H05K1/02 ; H05K1/03 ; H05K1/11

Abstract:
A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.
Public/Granted literature
- US20180048047A1 SPLIT RESONATOR AND PRINTED CIRCUIT BOARD INCLUDING THE SAME Public/Granted day:2018-02-15
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