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公开(公告)号：US20150241935A1
公开(公告)日：2015-08-27
申请号：US14626664
申请日：2015-02-19
发明人： Ki-Youn Jang , Kyung-Ha Koo , Kun-Tak Kim , Ki-Cheol Bae , Hyun-Deok Seo , Hyun-Tae Jang , Jong-Chul Choi
CPC分类号： G06F1/203 , G06F1/1626 , G06F1/1635 , G06F1/1684
摘要： A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.
摘要翻译： 提供具有辐射功能的移动通信终端。 移动通信终端包括：显示模块; 后盖; 位于所述显示模块和所述后盖之间并且包括面对所述显示模块的第一表面和面向所述显示模块的相对侧的第二表面的内部支撑结构; 位于支撑结构的第一表面和显示模块之间的第一辐射热片; 位于第一辐射热片与支撑结构的第一表面之间的印刷电路板; 以及位于所述支撑结构的第二表面和所述后盖之间的第二辐射热片。
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公开(公告)号：US11387220B2
公开(公告)日：2022-07-12
申请号：US16650578
申请日：2018-07-17
发明人： Kyung Woon Jang , Hyun-Tae Jang , Youngjun Moon , Changjoon Lee
IPC分类号： H01L25/075 , H01L27/12 , H01L33/24 , H01L33/62
摘要： A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.
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公开(公告)号：USRE48641E1
公开(公告)日：2021-07-13
申请号：US16287888
申请日：2019-02-27
发明人： Ki-Youn Jang , Kyung-Ha Koo , Kun-Tak Kim , Ki-Cheol Bae , Hyun-Deok Seo , Hyun-Tae Jang , Jong-Chul Choi
摘要： A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.
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公开(公告)号：US11805633B2
公开(公告)日：2023-10-31
申请号：US16638645
申请日：2018-07-11
发明人： Hyun-Tae Jang , Min Park , Byung Hoon Lee , Youngchul Lee , Changjoon Lee , Jiyoung Jang , Youngjun Moon , Minyoung Park , Jeonggen Yoon , Won Choi , Siho Jang
CPC分类号： H05K13/041 , H01L33/005 , H05K13/02 , H05K13/0409 , Y10T29/53174
摘要： According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.
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公开(公告)号：US11355479B2
公开(公告)日：2022-06-07
申请号：US16650578
申请日：2018-07-17
发明人： Kyung Woon Jang , Hyun-Tae Jang , Youngjun Moon , Changjoon Lee
IPC分类号： H01L25/075 , H01L27/12 , H01L33/24 , H01L33/62
摘要： A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.
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公开(公告)号：US10542646B2
公开(公告)日：2020-01-21
申请号：US15937646
申请日：2018-03-27
发明人： Chang-Joon Lee , Yong-Won Lee , Hyun-Tae Jang
IPC分类号： H05K1/09 , H05K9/00 , H05K3/30 , H05K1/18 , H05K1/03 , H05K1/05 , H05K3/34 , B32B15/01 , B23K35/02 , B23K35/26 , C22C9/04 , C22C38/40 , C22C9/06 , H05K1/02 , B23K101/42
摘要： According to various embodiments of the present disclosure, a metal unit may include: a core metal layer that is mainly composed of iron (Fe); and an outer layer formed on at least one face of the core metal layer, and bonded to solder so as to be attached to a printed circuit board. The metal unit and an electronic device including the same may be variously implemented according to embodiments.
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公开(公告)号：US09832859B2
公开(公告)日：2017-11-28
申请号：US14813448
申请日：2015-07-30
发明人： Yong Won Lee , Hyun-Tae Jang , Jung Je Bang
CPC分类号： H05K1/0216 , G06F1/18 , H05K1/181 , H05K9/0032 , H05K2201/09972 , H05K2201/10371
摘要： A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.
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公开(公告)号：US09582051B2
公开(公告)日：2017-02-28
申请号：US14626664
申请日：2015-02-19
发明人： Ki-Youn Jang , Kyung-Ha Koo , Kun-Tak Kim , Ki-Cheol Bae , Hyun-Deok Seo , Hyun-Tae Jang , Jong-Chul Choi
CPC分类号： G06F1/203 , G06F1/1626 , G06F1/1635 , G06F1/1684
摘要： A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.
摘要翻译： 提供具有辐射功能的移动通信终端。 所述移动通信终端包括：显示模块; 后盖; 位于所述显示模块和所述后盖之间并且包括面对所述显示模块的第一表面和面向所述显示模块的相对侧的第二表面的内部支撑结构; 位于支撑结构的第一表面和显示模块之间的第一辐射热片; 位于第一辐射热片与支撑结构的第一表面之间的印刷电路板; 以及位于所述支撑结构的第二表面和所述后盖之间的第二辐射热片。
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公开(公告)号：US10573951B2
公开(公告)日：2020-02-25
申请号：US15603582
申请日：2017-05-24
发明人： Soon Yong Lee , Yeon Sik Yu , Il Kim , Keon Young Seo , Min-Goo Seo , Jae-Deok Lim , Si Ho Jang , Hyun-Tae Jang
摘要： A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.
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公开(公告)号：US10117367B2
公开(公告)日：2018-10-30
申请号：US14625104
申请日：2015-02-18
发明人： Hyun-Tae Jang , Yong Won Lee , Jung Je Bang , Kwang Sub Lee
IPC分类号： H05K9/00
摘要： A fastening structure for a shield can is capable of ensuring easy attachment/detachment of the shield can and prevents deformation caused by excessive impact when the shield can is attached and detached by improving the fastening structure for a shield can fixed to a printed circuit board. The fastening structure for a shield can provided to shield a printed circuit board on which electronic components are mounted and the electronic components from electromagnetic waves includes a frame provided with a fixing part allowing the frame to be fixed to the printed circuit board, a shield cover provided to surround an outer side of the frame, fastening parts provided at the shield cover and the frame, respectively, such that the shield cover and the frame are attached/detached to/from each other. The fastening parts and the fixing part are disposed without overlapping each other.
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