公开(公告)号：US10573951B2

公开(公告)日：2020-02-25

申请号：US15603582

申请日：2017-05-24

申请人： Samsung Electronics Co., Ltd.

发明人： Soon Yong Lee ,  Yeon Sik Yu ,  Il Kim ,  Keon Young Seo ,  Min-Goo Seo ,  Jae-Deok Lim ,  Si Ho Jang ,  Hyun-Tae Jang

IPC分类号： H01P7/08 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

摘要： A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.