A functionalized adhesive and systems and methods employing the same are disclosed. The functionalized adhesive is configured to form an adhesive joint between a first substrate and a second substrate. The functionalized adhesive comprises a neat adhesive selected to have a bonding strength above a predetermined bonding threshold and a filler selectively dispersed within the neat adhesive. The filler is selected to modify electrical properties of the neat adhesive such that the functionalized adhesive is electrically conductive with a tailored resistivity and such that a resistance of the adhesive joint is greater than a resistance of the first substrate and the second substrate.