Invention Grant
- Patent Title: Modular thermoforming system
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Application No.: US14946720Application Date: 2015-11-19
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Publication No.: US10576680B2Publication Date: 2020-03-03
- Inventor: Karen L. Hills , Sergio H. Sanchez , Douglas Alan Brown , Jason Christopher Lail , Michael John Cloud , Jason Turner , Richard V. Phillips , Robert Cook , Hun Sok Basom , DeWayne F. Wendt
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Kolisch Hartwell, P.C.
- Main IPC: B29C51/22
- IPC: B29C51/22 ; B29C51/26 ; B29C51/30 ; B29C51/42 ; B29C43/04 ; B29C43/46 ; B29C43/08 ; B29C51/20 ; B29K101/12

Abstract:
A thermoforming system and related methods for manufacturing thermoplastic parts, such as interior panels for aircraft, may include a roll-to-roll operation and a forming press having at least one selectively rotatable tool. The rotatable tool, which may include a mold and/or a die, may be multifaceted, such that different faces of the tool have different mold arrangements for different forming characteristics.
Public/Granted literature
- US20170144361A1 MODULAR THERMOFORMING SYSTEM Public/Granted day:2017-05-25
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