Invention Grant
- Patent Title: Fingerprint identification device and manufacturing method thereof, array substrate and display apparatus
-
Application No.: US15514324Application Date: 2016-09-01
-
Publication No.: US10579852B2Publication Date: 2020-03-03
- Inventor: Changfeng Li , Xue Dong , Xiaochuan Chen , Haisheng Wang , Yingming Liu , Shengji Yang , Xiaoliang Ding , Weijie Zhao , Wei Liu , Pengpeng Wang , Lei Wang , Pengcheng Lu , Jun Long
- Applicant: BOE Technology Group Co., Ltd. , Beijing BOE Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BOE Technology Group Co., Ltd.,Beijing BOE Optoelectronics Technology Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.,Beijing BOE Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Banner & Witcoff, Ltd.
- Priority: CN201610006717 20160105
- International Application: PCT/CN2016/097811 WO 20160901
- International Announcement: WO2017/118060 WO 20170713
- Main IPC: G06K9/00
- IPC: G06K9/00 ; H01L27/12 ; H01L29/786 ; H01L31/105 ; H01L27/146

Abstract:
A fingerprint identification device and a manufacturing method thereof, an array substrate and a display apparatus are provided. The fingerprint identification device comprises first gate lines and read signal lines. The first gate lines and the read signal lines intersect with each other to define a plurality of fingerprint identification units, and each fingerprint identification unit is provided with a photosensitive element and a first transistor. The photosensitive element includes a first electrode layer, and a first doped semiconductor layer, a second doped semiconductor layer and a second electrode layer which are sequentially positioned on a surface of the first electrode layer.
Public/Granted literature
Information query