Invention Grant
- Patent Title: Apparatus for wire handling and embedding on and within 3D printed parts
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Application No.: US15244061Application Date: 2016-08-23
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Publication No.: US10582619B2Publication Date: 2020-03-03
- Inventor: David Espalin , Daniel Marquez , Alfonso Fernandez , Chiyen Kim , Eric MacDonald , Ryan Wicker
- Applicant: Board of Regents, The University of Texas System
- Applicant Address: US TX Austin
- Assignee: Board of Regents, The University of Texas System
- Current Assignee: Board of Regents, The University of Texas System
- Current Assignee Address: US TX Austin
- Agency: Yee & Associates, P.C.
- Main IPC: H05K3/10
- IPC: H05K3/10 ; B33Y80/00

Abstract:
An apparatus, system, and method for automatically dispensing and embedding components into three-dimensional parts. In an example embodiment, a direct wire embedding head can be fixed on an automation motion system. The direct wire embedding head begins and terminates an embedded wire pattern on a layer or on a surface of a three-dimensional part in order to automatically create the embedded wire pattern. A sensor is located on an embedding surface wherein the embedded wire pattern is embedded. The sensor can measure the distance between the direct wire embedding head and the embedding surface. A predefined distance can be maintained to ensure successful embedding results for the embedded wire pattern by automatically adjusting a position of the direct wire embedding head in response to feedback from the sensor.
Public/Granted literature
- US20170064840A1 METHOD AND APPARATUS FOR WIRE HANDLING AND EMBEDDING ON AND WITHIN 3D PRINTED PARTS Public/Granted day:2017-03-02
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