Abstract:
A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.
Abstract:
A three-dimensional electronic, biological, chemical, thermal management, and/or electromechanical apparatus can be configured by depositing one or more layers of a three-dimensional structure on a substrate. Such a three-dimensional structure can include one or more internal cavities using an additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be further configured with structural integrated metal objects spanning the internal cavities (possibly filled with air or even evacuated) of the three-dimensional structure for enhanced electromagnetic properties.
Abstract:
An apparatus, system, and method for automatically dispensing and embedding components into three-dimensional parts. In an example embodiment, a direct wire embedding head can be fixed on an automation motion system. The direct wire embedding head begins and terminates an embedded wire pattern on a layer or on a surface of a three-dimensional part in order to automatically create the embedded wire pattern. A sensor is located on an embedding surface wherein the embedded wire pattern is embedded. The sensor can measure the distance between the direct wire embedding head and the embedding surface. A predefined distance can be maintained to ensure successful embedding results for the embedded wire pattern by automatically adjusting a position of the direct wire embedding head in response to feedback from the sensor.
Abstract:
An embedded material and an embedding apparatus and method. A compatible solute can be dissolved in a solvent. The object to be embedded can be coated with the solvent/plastic solution using, for example, addition and/or condensation polymerization. The solvent can be removed. The coated object can be inserted, snap fit, or submerged into a partially 3D printed substrate with or without the aid of ultrasonic embedding, thermal energy, joule heating, and/or the use of adhesives, and the 3D printing process resumes in order to fully embed the coated object within the 3D printed substrate. The coated object can be inserted, snap fit, or submerged into a partially 3D printed substrate with or without the addition of ultrasonic embedding, thermal energy, joule heating, and/or adhesives, and the 3D printing process resumes in order to fully embed the coated object within the 3D printed substrate.
Abstract:
A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method thereof. One or more layers of a three-dimensional structure are deposited on a substrate. The three-dimensional structure is configured to include one or more internal cavities using, an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure includes one or more structural integrated metal objects spanning the one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties and bonded between two or more other metal objects located at the same layer or different layers of the three-dimensional structure.
Abstract:
An apparatus, system, and method for automatically dispensing and embedding components into three-dimensional parts. In an example embodiment, a direct wire embedding head can be fixed on an automation motion system. The direct wire embedding head begins and terminates an embedded wire pattern on a layer or on a surface of a three-dimensional part in order to automatically create the embedded wire pattern. A sensor is located on an embedding surface wherein the embedded wire pattern is embedded. The sensor can measure the distance between the direct wire embedding head and the embedding surface. A predefined distance can be maintained to ensure successful embedding results for the embedded wire pattern by automatically adjusting a position of the direct wire embedding head in response to feedback from the sensor.
Abstract:
Systems and methods for transporting parts between manufacturing and processing stations. A portable platform can be implemented in association with a robot for transporting the portable platform to and from a group of manufacturing and processing stations. The robot includes a robot arm with an end effector that includes a gripping mechanism that is actuated to mate with a gripping block affixed on the portable platform, thereby reducing errors in registration and relieving an operator of a need to manually remove parts with respect to the manufacturing and processing stations. An advantage of this system/method is that the robot can be made available to a wide variety of other tasks such as post fabrication assembly.
Abstract:
A three-dimensional electronic, biological, chemical, thermal management, and/or electromechanical apparatus can be configured by depositing one or more layers of a three-dimensional structure on a substrate. Such a three-dimensional structure can include one or more internal cavities using an additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be further configured with structural integrated metal objects spanning the internal cavities (possibly filled with air or even evacuated) of the three-dimensional structure for enhanced electromagnetic properties.
Abstract:
A method of forming a crack-free aluminum alloy structure using additive manufacturing is presented. A powder bed of precursor aluminum alloy powder is heated. The crack-free aluminum alloy structure is formed within a laser powder bed fusion system encompassing the powder bed during heating.
Abstract:
Methods, systems, and devices for the manufacture of 3D printed components with structurally integrated metal objects using an additive manufacturing system enhanced with a range of possible secondary embedding processes. One or more layers of a three-dimensional substrate can be created by depositing a substrate, and then one or more 3D printed components can be configured on the substrate with one or more metal objects using additive manufacturing enhanced by one or more secondary embedding processes.