Invention Grant
- Patent Title: Image pickup unit, wiring board with cable, and manufacturing method of wiring board with cable
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Application No.: US15374459Application Date: 2016-12-09
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Publication No.: US10582839B2Publication Date: 2020-03-10
- Inventor: Takatoshi Igarashi
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2014-123679 20140616
- Main IPC: A61B1/05
- IPC: A61B1/05 ; H05K3/36 ; H05K1/11 ; H04N5/225 ; G02B23/24 ; A61B1/00 ; H05K3/32 ; H05K1/14

Abstract:
An image pickup unit includes: an image pickup device on which an image pickup section is formed; a circuit board having a main surface on which a connection terminal electrically connected with the image pickup section is disposed; an intermediate wiring board including a substrate, an adhesive layer and a wiring pattern, in which a first electrode of the wiring pattern is electrically connected with the connection terminal; a cable having a core wire; and a holding substrate configured to hold the core wire with a second electrode and fixed to the intermediate wiring board by the adhesive layer in a state that the core wire and the second electrode are electrically connected by being in close contact.
Public/Granted literature
- US20170086660A1 IMAGE PICKUP UNIT, WIRING BOARD WITH CABLE, AND MANUFACTURING METHOD OF WIRING BOARD WITH CABLE Public/Granted day:2017-03-30
Information query
IPC分类: