公开(公告)号：US10582839B2

公开(公告)日：2020-03-10

申请号：US15374459

申请日：2016-12-09

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi

IPC: A61B1/05 ,  H05K3/36 ,  H05K1/11 ,  H04N5/225 ,  G02B23/24 ,  A61B1/00 ,  H05K3/32 ,  H05K1/14

Abstract: An image pickup unit includes: an image pickup device on which an image pickup section is formed; a circuit board having a main surface on which a connection terminal electrically connected with the image pickup section is disposed; an intermediate wiring board including a substrate, an adhesive layer and a wiring pattern, in which a first electrode of the wiring pattern is electrically connected with the connection terminal; a cable having a core wire; and a holding substrate configured to hold the core wire with a second electrode and fixed to the intermediate wiring board by the adhesive layer in a state that the core wire and the second electrode are electrically connected by being in close contact.

公开(公告)号：US09698195B2

公开(公告)日：2017-07-04

申请号：US14994581

申请日：2016-01-13

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi ,  Noriyuki Fujimori ,  Kazuhiro Yoshida

IPC: H01L27/146 ,  H01L25/04 ,  H04N5/225 ,  H04N5/335 ,  H01L23/31

CPC classification number: H01L27/14698 ,  H01L23/3121 ,  H01L25/042 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2924/0002 ,  H04N5/2254 ,  H04N5/335 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of cutting an image pickup chip substrate where electrode pads are formed around each of the light receiving sections to fabricate image pickup chips; a process of bonding image pickup chips determined as non-defective products to a glass wafer to fabricate a joined wafer; a process of filling a sealing member among the image pickup chips on the joined wafer; a machining process including a thinning a thickness of the joined wafer to flatten a machining surface and a forming through-hole interconnections, each of which is connected to each of the electrode pads; a process of forming a plurality of external connection electrodes, each of which is connected to each of the electrode pads via each of the through-hole interconnections; and a process of cutting the joined wafer.

公开(公告)号：US09313382B2

公开(公告)日：2016-04-12

申请号：US13790884

申请日：2013-03-08

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi

IPC: A61B1/00 ,  H04N5/225 ,  A61B1/05 ,  H01L27/146

CPC classification number: H04N5/2254 ,  A61B1/00064 ,  A61B1/00096 ,  A61B1/051 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The application is directed to an image pickup system that includes a lens holder; an image pickup optical system that is secured by a portion of the lens holder; an image pickup device comprising a first surface and a second surface, wherein the first surface is nearer the image pickup optical system than the second surface in an optical axis direction, a light receiving sensor that receives light entering through the image pickup optical system, and a cover glass attached to the first surface of the image pickup device, wherein the cover glass comprising a fitting portion of the cover glass in an outer circumferential face of the cover glass.

Abstract translation: 该应用涉及一种包括镜头保持器的图像拾取系统; 由透镜保持器的一部分固定的摄像光学系统; 包括第一表面和第二表面的图像拾取装置，其中所述第一表面在光轴方向上比所述第二表面更靠近所述图像拾取光学系统;受光传感器，其接收通过所述图像拾取光学系统进入的光;以及 盖玻璃，其附接到图像拾取装置的第一表面，其中所述盖玻璃包括在所述盖玻璃的外周面中的所述盖玻璃的嵌合部分。

公开(公告)号：US08937362B2

公开(公告)日：2015-01-20

申请号：US13975578

申请日：2013-08-26

Applicant: Olympus Corporation

Inventor： Takatoshi Igarashi

IPC: H01L31/0203 ,  H01L23/16 ,  H01L27/146

CPC classification number: H01L31/0203 ,  H01L23/16 ,  H01L27/14618 ,  H01L27/14627 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An image pickup apparatus includes a semiconductor chip including a light receiving section, a frame-like spacer arranged on the semiconductor chip to surround the light receiving section, a transparent flat plate section arranged on the semiconductor chip via the spacer and having a plan view dimension larger than a plan view dimension of the spacer and smaller than a plan view dimension of the semiconductor chip, and a reinforcing member for filling a gap between the semiconductor chip and the transparent flat plate section on the outer side of the spacer and having a plan view dimension larger than the plan view dimension of the transparent flat plate section and smaller than the plan view dimension of the semiconductor chip.

Abstract translation: 一种图像拾取装置包括：半导体芯片，包括光接收部分，布置在半导体芯片上以围绕光接收部分的框状间隔件;透明平板部分，其经由间隔件布置在半导体芯片上，并且具有平面图尺寸 大于所述间隔件的平面图尺寸并且小于所述半导体芯片的平面图尺寸;以及加强构件，用于填充所述间隔件的外侧上的所述半导体芯片和所述透明平板部之间的间隙，并具有计划 视图尺寸大于透明平板部分的平面视图尺寸并且小于半导体芯片的平面图尺寸。

公开(公告)号：US10757301B2

公开(公告)日：2020-08-25

申请号：US16403782

申请日：2019-05-06

Applicant: OLYMPUS CORPORATION

Inventor： Ken Yamamoto ,  Takuro Suyama ,  Takahiro Shimohata ,  Takatoshi Igarashi ,  Hiroshi Kobayashi

IPC: A61B1/04 ,  H04N5/225 ,  A61B1/05 ,  H01L27/146 ,  H01L25/065 ,  H01L25/18 ,  H04N5/369 ,  H01L27/14 ,  H01L25/07

Abstract: An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.

公开(公告)号：US10739576B2

公开(公告)日：2020-08-11

申请号：US15802512

申请日：2017-11-03

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi

IPC: G02B23/24 ,  H04N5/225 ,  A61B1/05 ,  G02B7/02 ,  A61B1/00 ,  G02B7/00 ,  A61B1/04 ,  A61B1/045

Abstract: An imaging apparatus includes: an optical system configured to collect incident light; an imaging element including a light receiver configured to receive light input from the optical system and perform photoelectric conversion to generate an electrical signal; and an optical system adhesive layer configured to bond the optical system to a principal surface of the imaging element where the light receiver is provided. The optical system adhesive layer is a photosensitive transparent adhesive for which patterning is performed through a photolithography process and which has a function of determining a position of the optical system relative to the light receiver.

公开(公告)号：US20190175004A1

公开(公告)日：2019-06-13

申请号：US16280335

申请日：2019-02-20

Applicant: Olympus Corporation

Inventor： Takuro Suyama ,  Takatoshi Igarashi ,  Kensuke Suga

IPC: A61B1/05 ,  H01L27/146 ,  H01L23/00 ,  H01L23/31 ,  A61B1/00 ,  A61B1/045

Abstract: The disclosed technology is directed to an imaging module of an endoscope comprises a plurality of semiconductor devices includes first and second semiconductor devices being electrically stacked to one another with a sealing layer interposed therebetween to transmit signals via a signal cable connected to a rear wall of the plurality of semiconductor devices. The first semiconductor device includes respective opposed first and second major surfaces having a first central region. The first major surface includes a semiconductor circuit portion disposed in the central region thereof. A through-silicon via is disposed in an intermediate region surrounding the first central region and is connected to the semiconductor circuit portion. The second major surface includes a first electrode located in the first central region thereof. The first electrode is connected to the through-silicon via. The second semiconductor device includes respective opposed third and fourth major surfaces having a second central region.

公开(公告)号：US20180220879A1

公开(公告)日：2018-08-09

申请号：US15939740

申请日：2018-03-29

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi ,  Noriyuki Fujimori ,  Makoto Ono ,  Masashi Saito ,  Satoru Adachi ,  Nana Akahane ,  Takanori Tanaka ,  Katsumi Hosogai

IPC: A61B1/05 ,  A61B1/045 ,  A61B1/06 ,  A61B1/00 ,  H04N5/378 ,  H04N5/345 ,  H04N5/376 ,  H04N7/10 ,  H01L27/146 ,  H01L21/66

CPC classification number: A61B1/05 ,  A61B1/00195 ,  A61B1/045 ,  A61B1/063 ,  A61B1/0638 ,  H01L22/32 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01L27/14 ,  H01L27/146 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469 ,  H04N5/2256 ,  H04N5/23203 ,  H04N5/345 ,  H04N5/3765 ,  H04N5/378 ,  H04N5/379 ,  H04N7/102 ,  H04N2005/2255

Abstract: An imaging device includes: a first chip including a light receiving unit, and a read circuit; a second chip including a timing control circuit, an A/D conversion circuit, and a cable transmission circuit; and a connection unit configured to connect the first and the second chips. The read circuit includes a column read circuit and a horizontal selection circuit, and a vertical selection circuit. The connection unit of the first chip is provided in a first area along a side of the rectangular light receiving unit, and in a second area adjacent to the column read circuit, the horizontal selection circuit, and the vertical selection circuit. The connection unit of the second chip is provided in a third area around the timing control circuit, the A/D conversion circuit, and the cable transmission circuit and in a fourth area adjacent to the timing control circuit and the A/D conversion circuit.

公开(公告)号：US10015375B2

公开(公告)日：2018-07-03

申请号：US14676045

申请日：2015-04-01

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki Fujimori ,  Takatoshi Igarashi

IPC: A62B1/04 ,  H04N5/225 ,  H01L27/146 ,  A61B1/05

CPC classification number: H04N5/2251 ,  A61B1/051 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H04N5/2253 ,  H04N2005/2255 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An image pickup device including a vacant space portion that allows a connection electrode to be exposed to a second main surface side, the vacant space portion being formed at a position overlapping at least the connection electrode in a state where the image pickup device is viewed in plan view from a thickness direction A, and the connection electrode exposed to the second main surface side is electrically connected with a substrate at a position in the vacant space portion, the position overlapping the image pickup device in the state where the image pickup device is viewed in plan view from the thickness direction.

公开(公告)号：US09486127B2

公开(公告)日：2016-11-08

申请号：US14192148

申请日：2014-02-27

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi ,  Noriyuki Fujimori ,  Yukiharu Makino

IPC: A61B1/06 ,  A61B1/04 ,  A61B1/00

CPC classification number: A61B1/041 ,  A61B1/00016 ,  A61B1/00032 ,  A61B1/0661

Abstract: A capsule endoscope includes a capsule type housing and a circuit board on which a plurality of board sections are arranged in a row, the circuit board being housed inside the housing in a bent state. Connection electrodes for electronic component mounting are not formed on a second principal plane of the circuit board.

Abstract translation: 胶囊型内窥镜包括：胶囊型壳体和电路基板，多个基板部分排列成一列，电路板以弯曲状态容纳在壳体内。 用于电子元件安装的连接电极不形成在电路板的第二主平面上。