Invention Grant
- Patent Title: Semiconductor device modules including a die electrically connected to posts and related methods
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Application No.: US16397800Application Date: 2019-04-29
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Publication No.: US10586780B2Publication Date: 2020-03-10
- Inventor: Ashok Pachamuthu , Chan H. Yoo , Szu-Ying Ho , John F. Kaeding
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/00 ; H01L23/00 ; H01L21/768 ; H01L25/00 ; H01L21/56 ; H01L21/683 ; H01L25/065 ; H01L23/31 ; H01L23/538 ; H01L23/498 ; H01L21/48
Abstract:
Semiconductor device modules may include a semiconductor die and posts located laterally adjacent to the semiconductor die. A first encapsulant may laterally surround the semiconductor die and the posts. Electrical connectors may extend laterally from the posts, over the first encapsulant, to bond pads on an active surface of the semiconductor die. A protective material may cover the electrical connectors. A second encapsulant may cover the protective material and the electrical connectors. The second encapsulant may be in direct contact with the first encapsulant, the electrical connectors, and the protective material.
Public/Granted literature
- US20190252342A1 SEMICONDUCTOR DEVICE MODULES AND RELATED METHODS Public/Granted day:2019-08-15
Information query
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