- Patent Title: Method and apparatus for performing high throughput tessellation
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Application No.: US16057212Application Date: 2018-08-07
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Publication No.: US10593111B2Publication Date: 2020-03-17
- Inventor: Timour T. Paltashev , Boris Prokopenko , Vladimir V. Kibardin
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Volpe and Koenig, P.C.
- Main IPC: G06T17/20
- IPC: G06T17/20 ; G06T15/00 ; G06T1/20
Abstract:
A method, a system, and a computer-readable storage medium directed to performing high-speed parallel tessellation of 3D surface patches are disclosed. The method includes generating a plurality of primitives in parallel. Each primitive in the plurality is generated by a sequence of functional blocks, in which each sequence acts independently of all the other sequences.
Public/Granted literature
- US20180342099A1 METHOD AND APPARATUS FOR PERFORMING HIGH THROUGHPUT TESSELLATION Public/Granted day:2018-11-29
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