Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16228872Application Date: 2018-12-21
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Publication No.: US10593775B2Publication Date: 2020-03-17
- Inventor: Yee-Chia Yeo , Sung-Li Wang , Chi On Chui , Jyh-Cherng Sheu , Hung-Li Chiang , I-Sheng Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L21/8234 ; H01L21/8238 ; H01L27/092 ; H01L23/522 ; H01L27/088 ; H01L29/08 ; H01L29/417 ; H01L29/78

Abstract:
A semiconductor device includes a field effect transistor (FET). The FET includes a first channel, a first source and a first drain; a second channel, a second source and a second drain; and a gate structure disposed over the first and second channels. The gate structure includes a gate dielectric layer and a gate electrode layer. The first source includes a first crystal semiconductor layer and the second source includes a second crystal semiconductor layer. The first source and the second source are connected by an alloy layer made of one or more Group IV element and one or more transition metal elements. The first crystal semiconductor layer is not in direct contact with the second crystal semiconductor layer.
Public/Granted literature
- US10546938B2 Semiconductor device and manufacturing method thereof Public/Granted day:2020-01-28
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