Invention Grant
- Patent Title: Electro-magnetic interference (EMI) shielding techniques and configurations
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Application No.: US15628430Application Date: 2017-06-20
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Publication No.: US10595409B2Publication Date: 2020-03-17
- Inventor: Adel A. Elsherbini , Ravindranath Mahajan , John S. Guzek , Nitin A. Deshpande
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H05K1/14 ; H01L23/552 ; H01L23/13 ; H01L23/498 ; H05K1/02 ; H01L25/065 ; H05K3/36

Abstract:
Embodiments of the present disclosure are directed towards electro-magnetic interference (EMI) shielding techniques and configurations. In one embodiment, an apparatus includes a first substrate, a die having interconnect structures coupled with the first substrate to route input/output (I/O) signals between the die and the first substrate and a second substrate coupled with the first substrate, wherein the die is disposed between the first substrate and the second substrate and at least one of the first substrate and the second substrate include traces configured to provide electro-magnetic interference (EMI) shielding for the die. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20170290155A1 ELECTRO-MAGNETIC INTERFERENCE (EMI) SHIELDING TECHNIQUES AND CONFIGURATIONS Public/Granted day:2017-10-05
Information query
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