Invention Grant
- Patent Title: Pressure-sensitive adhesive sheet for mobile electronics
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Application No.: US15529560Application Date: 2015-11-27
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Publication No.: US10596792B2Publication Date: 2020-03-24
- Inventor: Shuuhei Yamamoto , Kiichiro Matsushita
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-242183 20141128; JP2015-164268 20150821
- International Application: PCT/JP2015/083443 WO 20151127
- International Announcement: WO2016/084946 WO 20160602
- Main IPC: B32B27/40
- IPC: B32B27/40 ; B32B5/18 ; B32B7/06 ; B32B7/12 ; B32B27/36 ; B32B7/14 ; C09J133/14

Abstract:
Provided is a PSA sheet capable of bringing about good air release properties in mobile electronic applications. The present invention provides a PSA sheet for mobile electronics. The PSA sheet comprises a substrate film and a PSA layer provided to at least one face of the substrate film. The PSA layer has a thickness of 20 μm or less. The PSA sheet further comprises a coating layer that partially covers the PSA layer surface. The coating layer has a thickness less than 3 μm.
Public/Granted literature
- US20170335142A1 PRESSURE-SENSITIVE ADHESIVE SHEET FOR MOBILE ELECTRONICS Public/Granted day:2017-11-23
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